High Resolution Transmission Electron Microscopy of Aluminum/Mo-Coated Glass Substrate Interface Bonded by Ultrasonic Wire Welding
Author:
Affiliation:
1. Graduate School of Science and Technology, Kumamoto University
2. Toshiba Mitsubishi-Electric Industrial Systems Corporation
Publisher
Japan Society of Mechanical Engineers
Link
http://www.jstage.jst.go.jp/article/jmmp/5/12/5_12_803/_pdf
Reference22 articles.
1. (1) Murali, S., Srikanth, N., and Vath III, C. J., 2003, "Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding," Mater. Charact., 50(1), pp. 39-50.
2. (2) Krzanowski, J. E., 1990, "A Transmission Electron Microscopy Study of Ultrasonic Wire Bonding," IEEE Transactions on Components, Hybrids, and Manufacturing Technology.
3. (4) Brodyanski, A., Born, C., and Kopnarski, M., 2005, "Nm-scale resolution studies of the bond interface between ultrasonically welded Al-alloys by an analytical TEM: a path to comprehend bonding phenomena?," Appl. Surf. Sci., 252(1), pp. 94-97.
4. (5) Geissler, U., Schneider-Ramelow, M., Lang, K.-D., and Reichl, H., 2006, "Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires," J. Electron. Mater.
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06
2. Microstructure variation in the ultrasonic bonding process between Al sheets observed by in-situ transmission electron microscopy;Scripta Materialia;2023-09
3. Joining SiO2 based ceramics: recent progress and perspectives;Journal of Materials Science & Technology;2022-05
4. Microstructure Evaluation of Photovoltaic Solar Panel’s Interconnection: A Review;Materials Science Forum;2022-03-04
5. Interface Microstructure Welded by Ultrasonic Welding;Journal of Surface Analysis;2022-02-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3