Measurement of Thermal Conductivity and Thermal Diffusivity of Solid Materials Using a Novel Stamp Sensor: A Feasibility Study with Numerical Analysis-Reference-Cited by-同舟云学术

Measurement of Thermal Conductivity and Thermal Diffusivity of Solid Materials Using a Novel Stamp Sensor: A Feasibility Study with Numerical Analysis

Published:2012 Issue:4 Volume:7 Page:536-548
ISSN:1880-5566
Container-title:Journal of Thermal Science and Technology
language:en
Short-container-title:JTST

Author:

HADI Syamsul¹,NISHITANI Mamoru¹,WIJAYANTA Agung Tri²,KURATA Kosaku¹,TAKAMATSU Hiroshi¹

Affiliation:

1. Department of Mechanical Engineering, Kyushu University

2. Research and Education Center of Carbon Resources, Kyushu University

Publisher

Japan Society of Mechanical Engineers

Subject

Engineering (miscellaneous),Instrumentation,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.jstage.jst.go.jp/article/jtst/7/4/7_536/_pdf

Reference15 articles.

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2. (2) Hemberger, F., Ebert, H.P., and Fricke, J., Determination of the Local Thermal Diffusivity on Inhomogenous Samples by a Modified Laser-Flash Method, International Journal of Thermophysics, Vol. 28, No. 5, October 2007, 1509-1521.

3. Improvement of the laser flash method to reduce uncertainty in thermal diffusivity measurements

4. (7) Anis-ur-Rehman, M., and Maqsood, A., Measurement of Thermal Transport Properties with an Improved Transient Plane Source Technique, International Journal of Thermophysics, Vol. 24, No. 3, 2003, pp. 867-883.

5. (8) Almanza, O.M.A., Rodriguez-Perez, and De Saja, J.A., Applicability of the Transient Plane Source Method To Measure the Thermal Conductivity of Low-Density Polyethylene Foams, Journal of Polymer Science Part B: Polymer Physics, Vol. 42 (2004) 1226-1234.

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