Evaluating Strength of Adhesive Interface between Metal and Resin in Resin-Molded Structures

Author:

YAMAZAKI Miki1,IWASAKI Tomio1

Affiliation:

1. Hitachi Research Laboratory, Hitachi, Ltd.

Publisher

Japan Society of Mechanical Engineers

Reference14 articles.

1. (1) Okamoto, T., Shibuya M., Takahashi, T., Mizutani Y. and Takahashi T., “Proposal of All Solid Insulated Substation for Future Substation”, IEEE 7th Intern. Conf. Properties and Application of Dielectric materials,Vol. S22-4, (2003), pp.1190-1193.

2. (2) Sato, J., Sakaguchi O., Kubota, N., Makishima, S., S. Kinoshita, T. Shioiri, T.Yoshida, M. Miyagawa, M. Homma and E. Kaneko, “New Technology for Medium Voltage Solid Insulated Switchgear”, IEEE/PES Transmission and Distribution Conference and Exhibition: Asia Pacific, Vol.3, (2002), pp.1791-1796.

3. Effect of residual stress on delamination from interface edge between nano-films

4. Evaluation of interface strength of micro-dot on substrate by means of AFM

5. Analytical and experimental determination of the material intrinsic length scale of strain gradient plasticity theory from micro- and nano-indentation experiments

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