Data-Mining of Factors Affecting Circuit Connection Reliability on Laser-Drilled Micro Blind via Holes in Multi-Layer PWBs-Reference-Cited by-同舟云学术

Data-Mining of Factors Affecting Circuit Connection Reliability on Laser-Drilled Micro Blind via Holes in Multi-Layer PWBs

Published:2006 Issue:4 Volume:49 Page:522-528
ISSN:1344-7912
Container-title:JSME International Journal Series A
language:en
Short-container-title:JSME Int. J., Ser. A

Author:

OGAWA Keiji¹,HIROGAKI Toshiki²,AOYAMA Eiichi²,MAEDA Shinji³,INOUE Hisahiro⁴,KATAYAMA Tsutao²

Affiliation:

1. Department of Mechanical Systems Engineering, The University of Shiga Prefecture

2. Department of Mechanical Engineering, Doshisha University

3. Sakai Factory, KUBOTA Corporation

4. Department of Mechanical Engineering, Aichi University of Technology

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,General Materials Science

Link

http://www.jstage.jst.go.jp/article/jsmea/49/4/49_4_522/_pdf

Reference6 articles.

1. Thermal reliability of high density interconnects utilizing microvias and standard through‐hole technologies

2. (2) Burgess, W.L., Blind Microvia, Technology by Laser, National Electric Packaging and Production Conference Proceedings of the Technical Program 3, (1999), pp.1765-1772.

3. Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards

4. (4) Aoyama, E., Minagi, R., Hirogaki, T., Kondou, H., Katayama, T. and Inoue, H., Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes, ASME, Proceedings of IPACK03, (2003), 35086.

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