Heat Transfer Capacity of Lotus-type Porous Copper Heat Sink for Air Cooling-Reference-Cited by-同舟云学术

Heat Transfer Capacity of Lotus-type Porous Copper Heat Sink for Air Cooling

Published:2010 Issue:2 Volume:5 Page:222-237
ISSN:1880-5566
Container-title:Journal of Thermal Science and Technology
language:en
Short-container-title:JTST

Author:

CHIBA Hiroshi¹,OGUSHI Tetsuro²,NAKAJIMA Hideo³

Affiliation:

1. Advanced Technology R & D Center, Mitsubishi Electric Corporation

2. Department of Mechanical and Robotics, Faculty of Engineering, Hiroshima International University

3. The Institute of Scientific and Industrial Research, Osaka University

Publisher

Japan Society of Mechanical Engineers

Subject

Engineering (miscellaneous),Instrumentation,General Materials Science,Atomic and Molecular Physics, and Optics

Link

http://www.jstage.jst.go.jp/article/jtst/5/2/5_2_222/_pdf

Reference14 articles.

1. Pressure-driven water flows in trapezoidal silicon microchannels

2. Experimental verification of the role of Brinkman number in microchannels using local parameters

3. Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

4. (4) A. F. Bastawros, A. G. Evans, “Optimum Performance of Cellular Metal Heat Sinks for Thermal Management of High Power Electronics”, ASME EEP (Am. Soc. Mech. Eng. Electronic Packaging Div.),Vol.1, (1999), pp.733-736.

5. Effects of thermal dispersion on forced convection in fibrous media

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