Evaluation of Fracture Toughness of Interface Crack between Thin Film and Substrate Using Laser Ultrasonic Waves-Reference-Cited by-同舟云学术

Evaluation of Fracture Toughness of Interface Crack between Thin Film and Substrate Using Laser Ultrasonic Waves

Published:2011 Issue:773 Volume:77 Page:116-125
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

ARAI Masahiro¹,HAYASHI Hisashi,MIYAKE Tatsuya,CHO Hideo

Affiliation:

1. Department of Mechanical Systems Engineering, Shinshu University

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.jstage.jst.go.jp/article/kikaia/77/773/77_773_116/_pdf

Reference17 articles.

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2. (3) 丹野誠, 小山敦博, 渋谷陽二, "押込み試験によるDLC薄膜の強度評価法の検討", 日本機械学会関西支部講演会講演論文集No. 034-1, (2003), pp.5-37-5-38.

3. (4) Ikeda, R., Uchiyama, T., Cho, H., Ogawa, T., and Takemoto, M., “An advanced method for measuring the residual stress of deposited film utilizing laser spallation technique”, Journal of Science and Technology of Advanced Material, Vol. 7, No. 1, (2006), pp.90-96.

4. (5) Ikeda, R., Tasaka, S., Cho, H., and Takemoto, M., “Evaluation of Adhesive Strength of Chemical Vapor Deposition Diamond Films by Laser Spallation”, Japanese Journal of Applied Physics, Vol. 43, No. 5, (2004), pp.3123-3126.

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