Nondestructive Evaluation of Thermal Fatigue Lifetime in Flip Chip Solder Joints by Synchrotron Radiation X-Ray Microtomography(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)-Reference-Cited by-同舟云学术

Nondestructive Evaluation of Thermal Fatigue Lifetime in Flip Chip Solder Joints by Synchrotron Radiation X-Ray Microtomography(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

Published:2009 Issue:755 Volume:75 Page:799-806
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

TSURITANI Hiroyuki¹,SAYAMA Toshihiko,OKAMOTO Yoshiyuki,TAKAYANAGI Takeshi,UESUGI Kentaro,MORI Takao

Affiliation:

1. Toyama Industrial Technology Center:Toyama Prefectural University

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia1979/75/755/75_KJ00005652770/_pdf

Reference20 articles.

1. 1) LIE S. Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System. Proceeding of InterPACK2001, 7. (2001)

2. 2) TOHMYOH H. A High-resolution Dry-contact Acoustic Imaging of the Solder joints for Ball Grid Array Assembly. Proceeding of InterPACK2003, 7. (2003)

3. 3) SASOV A. Microlaminography for High-resolution BGA and Flip-chip Inspection. Proceeding of SPIE Conference on In-line Characterization, Yield, Reliability, and Failure Analyses in Microelectronic Manufacturing II. (2001) vol.4406, p.71-75.

4. 4) BERNARD D. Use of Digital X-ray Imaging as a Process Control Tool for Lead-free PWB Assembly. Proceeding of 2004 Surface Mount Technology Association International Conference, 9. (2004) p.548-552.

5. 5) DANCZAK M. Application of Computer Tomography in Electronic Technology. Proceeding of IEEE 26th International Spring Seminar on Electronics Technology, (2003-5). (2003) p.108-111.