Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line-Reference-Cited by-同舟云学术

Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line

Published:2013 Issue:799 Volume:79 Page:354-358
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

CHEN Chuantong¹,SHISHIDO Nobuyuki¹,KOIWA Kozo¹,KAMIYA Shoji¹,SATO Hisashi¹,NISHIDA Masahiro¹

Affiliation:

1. Department of Mechanical Engineering, Nagoya Institute of Technology

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia/79/799/79_354/_pdf

Reference5 articles.

1. (1) Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., Suzuki, T., Nakamura, T., Nokuo, T., Nagasawa, T. “Micro-Scale Evaluation of Interface Strength on the Patterned Structures in LSI Interconnects”, AIP Conference Proceedings, Vol. 1300, (2010), pp.33-38.

2. (2) Dauskardt, R. H., Lane, M., Ma, Q., Krishna, N. “Adhesion and debonding of multi-layer thin film structures”, Engineering Fracture Mechanics, Vol. 61, (1998), pp.141-162.

3. (3) Kamiya, S., Furuta, H., Omiya, M., Shimomura, H. “A novel evaluation method for interfacial adhesion strength in ductile dissimilar materials”, Engineering Fracture Mechanics, Vol. 75, (2008), pp.5007-5017.

4. (4) Hellen, T. K. “On the Method of Virtual Crack Extensions”, International Journal for Numerical Methods in Engineering, Vol. 9, No.1 (1975), pp.187-207.

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