Fracture Nano-Mechanics : 1st Report, Interface Strength of Nano-Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)
Author:
Affiliation:
1. Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University
Publisher
Japan Society of Mechanical Engineers
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://www.jstage.jst.go.jp/article/kikaia1979/75/755/75_KJ00005652767/_pdf
Reference16 articles.
1. 1) KRIESE M. D. Quantitative adhesion measures of multilayer films : Part I. Indentation mechanics. Journal of Materials Research. (1999) vol.14, p.3007-3018.
2. 3) OMIYA M. Evaluation of interfacial strength by multi-stages peel test. Key Engineering Materials. (2004) vol.261-263, p.483-488.
3. 4) SHANG F. Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate. International Journal of Solids and Structures. (2005) vol.42, p.1729-1741.
4. 5) HIRAKATA H. Evaluation of interface strength of micro-dot on substrate by means of AFM. International Journal of Solids and Structures. (2004) vol.41, p.3243-3253.
5. 6) HIRAKATA H. Dominant stress region for crack initiation at interface edge of micro-dot on a substrate. Engineering Fracture Mechanics. (2006) vol.73, p.2698-2709.
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