Fatigue Life Scatter of Lead-Free Solder Joints for Chip Components(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)-Reference-Cited by-同舟云学术

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Fatigue Life Scatter of Lead-Free Solder Joints for Chip Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

Published:2009 Issue:755 Volume:75 Page:815-822
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

MIYAUCHI Hiroki,YU Qiang¹,SHIBUTANI Tadahiro¹

Affiliation:

1. Department of Mechanical Engineering, Yokohama National University

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia1979/75/755/75_KJ00005652772/_pdf

Reference17 articles.

1. 1) KITANO M. A New Evaluation Method for the Thermal Fatigue Strength of Solder Joints. ASME, Advances in Electronic Packaging. (1992) vol.1-1, p.301-308.

2. 2) LAU J. H. Elastoplastic Analysis of Surface-Mount Solder Joints. IEEE Transactions on Components, Hybrids, and Manufacturing Technology. (1987) vol.CHMT-10, no.3, p.346-357.

3. 3) COFFIN L. F. A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal. Transactions of the ASME. (1954) vol.76, p.931-950.

4. 4) MANSON S. S. Behavior of Materials under Condition of Thermal Stress. (1953)

5. 5) LAU J. Solder Joint Crack Propagation Analysis of Wefer-Level Chip Scale Package on Printed Circuit Board Assemblies. Proceeding of Electric Components and Technology Conference ECTC, (2000-5). (2000) p.1360-1368.

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