Development of ΔK-decreasing test method of the metal film by displacement constraint along the elliptical through hole-edge
Author:
Affiliation:
1. Department of Mechanical Engineering, Meijo University
2. Graduate Student, Meijo University
Publisher
Japan Society of Mechanical Engineers
Subject
General Medicine
Link
https://www.jstage.jst.go.jp/article/mej/3/6/3_16-00274/_pdf
Reference21 articles.
1. Bartosiewicz, L, Krause, A. R., Spis, A., Raghavan, J. and Putatunda, S. K., Fatigue crack growth behavior of a solid solution-strengthened nickel-base superalloy (Incoloy 825), Journal of Materials Engineering and Performance, Vol. 1 (1992), pp.67-74.
2. Eshelby, J. D., The determination of the elastic field of an ellipsoidal inclusion and related problems, Proceedings of the Royal Society of London, Vol.241, Issue 1226 (1957), pp.376-396.
3. Hadrbolets, A., Weiss, B and Khatibi, G., Fatigue and fracture properties of thin metallic foils, International Journal of Fracture, Vol. 107 (2001), pp.307-327.
4. Hoffman, H. S., Griffiths, L., Monti, G. and Singh, B., Metal package for a high-power microprocessor chip, Proceedings of Advances in Electronic Packaging, ASME, Vol.1 (1992), pp.23-26.
5. Hudak, S. J. and Bucci, R. J., Fatigue crack growth measurement and data analysis, ASTM STP738 (1981).
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