Direct Laser Drilling in Copper Clad Printed Wiring Boards : Suppression of Overhang Length on Drilled Hole Using PWBs Mixed with Silica Fillers in Build-Up Layer(Machine Elements, Design and Manufacturing)-Reference-Cited by-同舟云学术

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Direct Laser Drilling in Copper Clad Printed Wiring Boards : Suppression of Overhang Length on Drilled Hole Using PWBs Mixed with Silica Fillers in Build-Up Layer(Machine Elements, Design and Manufacturing)

Published:2009 Issue:759 Volume:75 Page:3082-3088
ISSN:0387-5024
Container-title:Transactions of the Japan Society of Mechanical Engineers Series C
language:en
Short-container-title:Trans.JSME(C)

Author:

HIROGAKI Toshiki¹,AOYAMA Eiichi¹,OGAWA Keiji,MATSUTANI Shogo,AYUZAWA Tsukasa

Affiliation:

1. Department of Mechanical Engineering, Doshisha University

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

Link

https://www.jstage.jst.go.jp/article/kikaic1979/75/759/75_KJ00005879363/_pdf

Reference8 articles.

1. 1) BURGESS L. W. Blind microvia technology by laser. National Electronic Packaging and Production Conference Proceedings of the Technical Program, 1999. (1999) p.1765-1772.

2. 2) HIROGAKI T. PREDICTION OF DAMAGE WIDTH IN LASER DRILLING OF PRINTED WIRING BOARD USING FEM. Proceedings of the 11th International Conference on Composite Materials, (1997-7). (1997) p.IV343-IV351.

3. 3) The Japan Society of Mechanical Engineers. Heat Transfer Engineering Data. (1997) p.314-321.

4. 4) YOSHIKAWA S. Laser Process Technology handbook. Asakura Publishing Co. Ltd.. (1996) p.214-231.

5. 5) OWEN M. Circuit World. (1997) vol.24, no.1, p.45-49.

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