Heat Transfer Capacity of Lotus-Type Porous Copper Heat Sink-Reference-Cited by-同舟云学术

Heat Transfer Capacity of Lotus-Type Porous Copper Heat Sink

Published:2004 Issue:3 Volume:47 Page:516-521
ISSN:1340-8054
Container-title:JSME International Journal Series B
language:en
Short-container-title:JSME international journal. Ser. B, Fluids and thermal engineering

Author:

CHIBA Hiroshi¹,OGUSHI Tetsuro¹,NAKAJIMA Hideo²,IKEDA Teruyuki²

Affiliation:

1. Mechanical Systems Department, Adv. Tch., R&D Cent., Mitsubishi Electric Corporation

2. The Institute of Scientific and Industrial Research, Osaka University

Publisher

Japan Society of Mechanical Engineers

Subject

Fluid Flow and Transfer Processes,Physical and Theoretical Chemistry,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/jsmeb/47/3/47_3_516/_pdf

Reference10 articles.

1. Pressure-driven water flows in trapezoidal silicon microchannels

2. (2) Wei, X. and Joshi, Y., Stacked Micro-Channel Heat Sinks for Liquid Cooling of Microelectronic Components, Proceedings of ASME IMECE 2000 Int. Mec. Eng. Congress & Exposition, (2000).

3. (3) Bastawros, A.F., Evans, A.G. and Stone, H.A., Evaluation of Cellular Metal Heat Transfer Media, Preprint for Publication of Journal of Heat Transfer, March (1999).

4. Thermal Conductivities of Composite Materials

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