Experimental evaluation of threshold current density for electromigration damage in Al interconnect line with reservoir and sink structure
Author:
Affiliation:
1. Department of Intelligent Machines and System Engineering, Hirosaki University
Publisher
Japan Society of Mechanical Engineers
Subject
General Medicine
Link
https://www.jstage.jst.go.jp/article/mel/8/0/8_22-00035/_pdf
Reference13 articles.
1. Bigalke, S. and Lienig, J., Avoidance vs. repair: New approaches to increasing electromigration robustness in VLSI routing, Integration, Vol.75 (2020), pp.189-198.
2. Fu, C.M., Tan, C.M., Wu, S.H. and Yao, H.B., Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects, Microelectronics Reliability, Vol.50 (2010), pp.1332-1335.
3. Kimura, Y., Ikadai, H., Nakakura, T. and Saka, M., Suitable passivation thickness on a metal line to prevent electromigration damage, Materials Letters, Vol.184 (2016), pp.219-222.
4. Korhonen, M.A., Børgesen, P., Tu, K.N and Li, C.Y., Stress evolution due to electromigration in confined metal lines, Journal of Applied Physics, Vol.73 (1993), pp.3790-3799.
5. Pate, D.J., Helonde, J.B., Vairagar, A.V. and Mhaisalkar, S.G, A model for understanding electromigration-induced void evolution in dual-inlaid Cu interconnect structures, Journal of Electronic Materials, Vol.41 (2012), pp.568-572.
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3