Modifying the Power and Performance of 2-Dimensional MoS 2 Field Effect Transistors

Author:

Zhuo Fulin1,Wu Jie1,Li Binhong23,Li Moyang1,Tan Chee Leong1,Luo Zhongzhong4,Sun Huabin12,Xu Yong12,Yu Zhihao12

Affiliation:

1. College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, China.

2. Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, China.

3. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.

4. College of Electronic and Optical Engineering and College of Flexible Electronics (Future Technology), Nanjing University of Posts and Telecommunications, Nanjing 210023, China.

Abstract

Over the past 60 years, the semiconductor industry has been the core driver for the development of information technology, contributing to the birth of integrated circuits, Internet, artificial intelligence, and Internet of Things. Semiconductor technology has been evolving in structure and material with co-optimization of performance–power–area–cost until the state-of-the-art sub-5-nm node. Two-dimensional (2D) semiconductors are recognized by the industry and academia as a hopeful solution to break through the quantum confinement for the future technology nodes. In the recent 10 years, the key issues on 2D semiconductors regarding material, processing, and integration have been overcome in sequence, making 2D semiconductors already on the verge of application. In this paper, the evolution of transistors is reviewed by outlining the potential of 2D semiconductors as a technological option beyond the scaled metal oxide semiconductor field-effect transistors. We mainly focus on the optimization strategies of mobility ( μ ), equivalent oxide thickness ( EOT ), and contact resistance ( R C ), which enables high ON current ( I on ) with reduced driving voltage ( V dd ). Finally, we prospect the semiconductor technology roadmap by summarizing the technological development of 2D semiconductors over the past decade.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference194 articles.

1. Cramming more components onto integrated circuits;Moore GE;Electronics,1965

2. Design of ion-implanted MOSFETs with very small physical dimensions;Dennard RH;Proc IEEE,1999

3. Reliability challenges for copper interconnects;Li B;Microelectron Reliab,2004

4. Welser J Hoyt JL Takagi S-I Gibbons JF. Strain dependence of the performance enhancement in strained-Si n-MOSFETs. Paper presented at: Technical Digest-International Electron Devices Meeting; 1994; San Francisco CA.

5. n-Channel MOSFETs fabricated on SiGe dots for strain-enhanced mobility;Jovanovic V;IEEE Electron Device Lett,2010

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3