Prediction of Surface Profile Evolution of Workpiece and Lapping plate in Lapping Process

Author:

Geng Zhichao1,Zhou Ping2,Meng Lei3,Yan Ying4,Guo Dongming5

Affiliation:

1. No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024 Dalian, Liaoning 116024 China

2. No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province Dalian, Liaoning 116024 China

3. No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., Dalian, 116024 China

4. No.2 Linggong Road, High-Tech Zone, Dalian City, Liaoning Province, P. R. C., 116024 Dalian, 116024 China

5. No.2 Linggong Road, Ganjingzi District, Dalian City,116024 Dalian, Liaoning 116024 China

Abstract

Abstract Lapping has a history of hundreds of years, yet it still relies on the experience of workers. To improve the automaticity and controllability of the lapping process, a modeling method of friction and wear is developed to predict the surface profile evolution of the workpiece and lapping plate in the lapping process. In the proposed method, by solving the balance equations of resultant force and moment, the inclination angles of the workpiece can be calculated, thus more accurate contact pressure distribution of the workpiece/lapping plate interface can be calculated. Combined with the material removal rate model, the continuous evolution process of the workpiece and lapping plate can be predicted in the lapping process. The modeling method was validated by a lapping test of a flat optical glass (Φ 100 mm) with a composite copper plate. The results show that the proposed method can predict the evolution of the surface profile of the workpiece and lapping plate with high accuracy. Consequently, the lapping plate can be dressed at the right time point. Benefit from this, in the validation test the PV value of the workpiece (with 5 mm edge exclusion) was reduced from 5.279 μm to 0.267 μm in 30 min. The proposed surface profile evolution modeling method not only improves the lapping efficiency but also provides an opportunity to understand the lapping process.

Funder

Ministry of Science and Technology of the People's Republic of China

National Natural Science Foundation of China

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

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