An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion-Reference-Cited by-同舟云学术

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Published:2003-03-01 Issue:1 Volume:125 Page:76-83
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Rodgers Peter J.,Eveloy Vale´rie C.¹,Davies Mark R.²

Affiliation:

1. Electronics Thermal Management, Ltd., Upper Quay, Westport, Co. Mayo, Ireland

2. Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Ireland

Abstract

Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat transfer in forced convection using a widely used computational fluid dynamics (CFD) software. In Part I of this paper, the benchmark test cases, experimental methods and numerical models were described. Component junction temperature prediction accuracy for the populated board case is typically within ±5°C or ±10%, which would not be sufficient for temperature predictions to be used as boundary conditions for subsequent reliability and electrical performance analyses. Neither the laminar or turbulent flow model resolve the complete flow field, suggesting the need for a turbulence model capable of modeling transition. The full complexity of component thermal interaction is shown not to be fully captured.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/125/1/76/5697741/76_1.pdf

Reference12 articles.

1. Rodgers, P., 2000, “An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer,” Ph.D. thesis, Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Ireland.

2. Rodgers, P., Eveloy, V., Lohan, J., Fager, C. M., Tiilikka, P., and Rantala, J., 1999, “Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments,” Proc., Fifteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XV), pp. 55–64.

3. Rodgers, P., Lohan, J., Eveloy, V., Fager, C. M., and Rantala, J., 1999, “Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Air Flows by Experimental Analysis,” Advances in Electronic Packaging; Proceedings of The PACIFIC RIM/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK’99), EEP-Vol. 26-1, pp. 999–1009.

4. Mack, B., and Venus, T., 2000, “Thermal Challenges in the Telecom and Networks Industry,” Electronics Cooling, 6, No. 2, pp. 44–49.

5. Lasance, C. J. M. , 1995, “The need for a change in Thermal Design Philosophy,” Electronics Cooling, 1(2), pp. 24–26.

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