Calibrate Piezoresistive Stress Sensors Through the Assembled Structure-Reference-Cited by-同舟云学术

Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

Published:2003-06-01 Issue:2 Volume:125 Page:289-293
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Lwo Ben-Je¹,Wu Shen-Yu²

Affiliation:

1. Department of Mechanical Engineering, Chung-Cheng Institute of Technology, National Defense University, Ta-Shi, Tao-Yuan, Taiwan, 335, R. O. C.

2. Department of Weapon System Engineering, Chung-Cheng Institute of Technology, National Defense University, Ta-Shi, Tao-Yuan, Taiwan, 335, R. O. C.

Abstract

In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresistive stress sensors for microelectronic packaging can be simpler, more accurate, and more efficient. After comparing with the previous work results, validity of the aforementioned new structure has been demonstrated through experimental data. Since many accessory experimental facilities employed in traditional calibrations become unnecessary, the new methodology takes great advantage on piezoresistive coefficient extractions, especially for calibration at temperature other than room temperature.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/125/2/289/5802469/289_1.pdf

Reference14 articles.

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2. Lwo, B. J., Kao, C. H., Chen, T. S., and Chen, Y. S., 2002, “On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging,” ASME J. Electron. Packag., 124(1), pp. 22–26.

3. Lwo, B. J., Chen, T. S., Kao, C. H., and Lin, Y. L., 2002, “In-Plane Packaging Stress Measurements Through Piezoresistive Sensors,” ASME J. Electron. Packag., 124(2), June, pp. 115–121.

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