An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Author:

Qin Fei12,He Qi3,Gong Yanpeng12,Hou Chuantao4,Cheng Hao4,An Tong12,Dai Yanwei12,Chen Pei12

Affiliation:

1. Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology , Beijing 100124, China ; , Beijing 100124, China

2. Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology , Beijing 100124, China ; , Beijing 100124, China

3. Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology , Beijing 100124, China

4. Science and Technology on Reliability and Environment Engineering Laboratory, Beijing Institute of Structure and Environment Engineering , Beijing 100076, China

Abstract

Abstract We introduce a coupled finite and boundary element method for elastic-plastic analysis over multiscale electronic packaging structures. Based on the finite element-boundary element (FE-BE) coupling algorithm, an automatic implementation procedure for the coupling of the abaqus with a self-written elastic BE code is introduced for elastic problems. In the mixed finite element method (FEM)-boundary element method (BEM) model, the effective stiffness and effective forces at the interfacial boundary are evaluated by the self-written BE code. Then, the obtained effective stiffness and effective forces are assembled to the global FE formulations by using the user subroutine (UEL) in abaqus. Numerical simulation of structures with plastic deformation, stress concentration, etc. is carried out by using FEM theory. The boundary element method is used for linear elastic domains with large-scale structures. The proposed method offers several key improvements compared with current analysis methods available for multiscale electronic packaging structures. The benefits are: (i) the powerful pre- and postprocessing of abaqus; (ii) the higher accuracy of the solution; (iii) the computational cost and time can be reduced by using the scheme; and (iv) solving systems with infinite extension by using the BEM as a supplement. Furthermore, we demonstrate the ability of the proposed approach to handle multiscale structures in electronic packaging problems.

Funder

Beijing Municipal Education Commission

National Natural Science Foundation of China

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3