1. Lee, S., Song, S., Au, V., and Moran, K. P., 1995, “Constriction/Spreading Resistance Model for Electronics Packaging,” 4th ASME/JSME Thermal Engineering Joint Conference, Maui, HI, pp. 199–206.
2. Song, S., Lee, S., and Au, V., 1994, “Closed-Form Equation for Thermal Constriction/Spreading Resistances With Variable Resistance Boundary Condition,” Intelligent Energy and Power Systems Conference, Atlanta, GA, pp. 111–121.
3. Thermal Constriction Resistance Between Two Solids for Random Distribution of Contacts;Heat Mass Transfer,1999
4. Thermal Resistance in Rectangular Orthotropic Heat Spreaders,1999
5. Ellison, G., 1991, “Extensions of a Closed Form Method for Substrate Thermal Analyzers to Include Thermal Resistances From Source-to-Substrate and Source-to-Ambient,” 7th IEEE Semi-Therm Symposium, pp. 140–148.