Micro Heat Exchangers Consisting of Pin Arrays-Reference-Cited by-同舟云学术

Micro Heat Exchangers Consisting of Pin Arrays

Published:1997-03-01 Issue:1 Volume:119 Page:51-57
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Yin Xiaoqing¹,Bau H. H.¹

Affiliation:

1. Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, PA 19104-6315

Abstract

The performance of micro heat exchangers fabricated on silicon wafers and consisting ofpin arrays and straight channels is evaluated theoretically using three-dimensional numerical simulations. The coolant is liquid nitrogen and the objective is to maintain the wafer’s temperature below 90K so as to facilitate the use of high temperature superconductor interconnects in multichip modules. Both developing and periodic flows are considered. Comparisons of the performance of various geometric configurations are presented It is demonstrated that by proper selection of the heat of the heat exchanger’s geometry, the thermal resistance can be minimized.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/1/51/5567078/51_1.pdf

Reference24 articles.

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2. Asako Y. , and FaghriM., 1989, “Three-Dimensional Heat Transfer Analysis of Arrays of Heated Square Blocks,” International Journal of Heat Mass Transfer, Vol. 32, No. 2, pp. 395–405.

3. Aung, W., 1991, Cooling Techniques for Computers, Hemisphere, Washington, DC.

4. Bejan A. , and MoregaA. M., 1993, “Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection,” ASME JOURNAL OF HEAT TRANSFER, Vol. 115, pp. 75–81.

5. Bergles A. E. , 1986, “The Evolution of Cooling Technology for Electrical, Electronic and Microelectronic Equipment,” Heat Transfer in Electronic Equipment, ASME, HTD-57, pp. 1–9.

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