Thermal Enhancement Coatings for Microelectronic Systems-Reference-Cited by-同舟云学术

Thermal Enhancement Coatings for Microelectronic Systems

Published:1998-09-01 Issue:3 Volume:120 Page:229-237
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Fletcher L. S.¹,Lambert M. A.²,Marotta E. E.³

Affiliation:

1. Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123

2. Department of Mechanical Engineering, San Jose State University, San Jose, CA 95192-0087

3. Department of Mechanical Engineering, Clemson University, Clemson, SC 29634

Abstract

The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of thermally-induced failures in these systems, their thermal performance has become the focus of increasing concern. The use of thermally conducting interstitial coatings within and between electronic components has proven to be one technique suitable for thermal enhancement. This review will address both metallic and nonmetallic coatings suitable for thermal enhancement and discuss some of the major areas of application.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/120/3/229/5882103/229_1.pdf

Reference39 articles.

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3. Blanchard, D. G., Marotta, E. E., and Fletcher, L. S., 1992, “A Survey of the Thermal Conductivity of Synthetic and Natural Diamond Materials,” AIAA Paper 92-0708, 30th, Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 6–9.

4. Chung, K. C., Sheffield, J. W., and Sauer, H. J., Jr., 1990, “Effects of Metallic Coated Surfaces on Thermal Contact Conductance: An Experimental Study,” Proceedings of the 6th Miami Int. Symp. On Heat and Mass Transfer, Univ. of Miami, Miami, FL.

5. Chung, K. C., Sheffield, J. W., Sauer, H. J., Jr. and O’Keefe, T. J., 1991, “The Effects of Transitional Buffering Interface Coatings on Thermal Contact Conductance,” AIAA Paper 91-0490, The American Institute for Aeronautics and Astronautics, Reston, VA.

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