Radiant Interchange Within an Enclosure
Author:
Affiliation:
1. Shell Development Company, Emeryville, Calif.
2. Mechanical Engineering Department, University of California, Berkeley, Calif.
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/heattransfer/article-pdf/82/1/1/5907223/1_1.pdf
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3. Radiation Heat Exchange Between Electronic Components on a Circuit Board and the Walls of Its Enclosure;Heat Transfer Engineering;1994-01
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