Solder Joint Reliability of Surface Mount Connectors-Reference-Cited by-同舟云学术

Solder Joint Reliability of Surface Mount Connectors

Published:1993-06-01 Issue:2 Volume:115 Page:180-188
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Lau J.¹,Marcotte T.¹,Severine J.¹,Lee A.¹,Erasmus S.¹,Baker T.¹,Moldaschel J.¹,Sporer M.¹,Burward-Hoy G.¹

Affiliation:

1. Hewlett-Packard Company, Palo Alto, CA 94304

Abstract

The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the reliability of the solder joints of surface mount connectors has been recommended.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/115/2/180/5801028/180_1.pdf

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