Flow and Heat Transfer in Microchannels Using a Microcontinuum Approach-Reference-Cited by-同舟云学术

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Flow and Heat Transfer in Microchannels Using a Microcontinuum Approach

Published:1989-11-01 Issue:4 Volume:111 Page:1083-1085
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:

Author:

Jacobi A. M.¹

Affiliation:

1. The Johns Hopkins University, School of Mechanical Engineering, Baltimore, MD 21218

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/heattransfer/article-pdf/111/4/1083/5910127/1083_1.pdf

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages;Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306);1999

2. Modeling forced liquid convection in rectangular microchannels with electrokinetic effects;International Journal of Heat and Mass Transfer;1998-10

3. Thermal control of electronic equipment by heat pipes;Revue Générale de Thermique;1998-05

4. Review of Heat Transfer Technologies in Electronic Equipment;Journal of Electronic Packaging;1995-12-01

5. Effect of viscous dissipation on the lubrication characteristics of micropolar fluids;Acta Mechanica;1994-03

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