Tomography-Based Determination of the Effective Thermal Conductivity of Fluid-Saturated Reticulate Porous Ceramics

Author:

Petrasch Jörg1,Schrader Birte1,Wyss Peter2,Steinfeld Aldo3

Affiliation:

1. Department of Mechanical and Process Engineering, ETH Zurich, 8092 Zurich, Switzerland

2. Laboratory for Electronics/Metrology, EMPA Material Science and Technology, 8600 Dübendorf, Switzerland

3. Department of Mechanical and Process Engineering, ETH Zurich, 8092 Zurich, Switzerland and Solar Technology Laboratory, Paul Scherrer Institute, 5232 Villigen, Switzerland

Abstract

The effective thermal conductivity of reticulate porous ceramics (RPCs) is determined based on the 3D digital representation of their pore-level geometry obtained by high-resolution multiscale computer tomography. Separation of scales is identified by tomographic scans at 30μm digital resolution for the macroscopic reticulate structure and at 1μm digital resolution for the microscopic strut structure. Finite volume discretization and successive over-relaxation on increasingly refined grids are applied to solve numerically the pore-scale conduction heat transfer for several subsets of the tomographic data with a ratio of fluid-to-solid thermal conductivity ranging from 10−4 to 1. The effective thermal conductivities of the macroscopic reticulate structure and of the microscopic strut structure are then numerically calculated and compared with effective conductivity model predictions with optimized parameters. For the macroscale reticulate structure, the models by Dul’nev, Miller, Bhattachary and Boomsma and Poulikakos, yield satisfactory agreement. For the microscale strut structure, the classical porosity-based correlations such as Maxwell’s upper bound and Loeb’s models are suitable. Macroscopic and microscopic effective thermal conductivities are superimposed to yield the overall effective thermal conductivity of the composite RPC material. Results are limited to pure conduction and stagnant fluids or to situations where the solid phase dominates conduction heat transfer.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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