1. Bar-Cohen, A.
, 1992, “State-of-Art and Trends in the Thermal Packaging of Electronic Equipment,” ASME J. Electron. Packag., 114, pp. 257–270.
2. Suhir, E., 1988, “Thermal Stress Failures in Microelectronics Components-Review and Extension,” Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, Bar-Cohen, A., and Kraus, A. D., eds., Hemisphere, New York, pp. 373–412.
3. Ernsberger, F. M., 1980, “Techniques of Strengthening Glasses,” Glass: Science and Technology, Chapter 4, Uhlmann, D. R., and Kreidl, N. J., eds., Academic Press, N. J., Vol. 5, Elasticity and Strength in Glasses, pp. 133–144.
4. Karaev, A., and Kornilov, A., 1982, “Analysis of Peculiarities of the Separation Process of Semiconductor Wafers into Segments Used in the IC Technology,” Phys. Chem. Treatment Mater., 15, No. 1, pp. 64–67.
5. Elperin, T., Kornilov A., and Rudin, G., 1997, “Advanced Laser Technology for Precise Separation of Brittle Non-Metallic Materials,” Abstracts of the 8-th Israel Materials Engineering Conference, Beer-Sheva, April 16–17.