Why Parallelism of Workpieces Becomes Convergent During Double-Sided Lapping?

Author:

Pan Bo1,Kang Renke1,Zhu Xu1,Yang Zhe1,Zhang Juntao1,Guo Jiang23

Affiliation:

1. Dalian University of Technology State Key Laboratory of High-Performance Precision Manufacturing, , Dalian 116024 , China

2. Dalian University of Technology State Key Laboratory of High-Performance Precision Manufacturing, , Dalian 116024 , China ;

3. Dalian University of Technology Ningbo Institute of Dalian University of Technology, , Ningbo 315000 , China

Abstract

AbstractDouble-sided lapping (DSL) is always employed as a precision process for machining flat workpieces, such as optical windows, wafers, and brake pads taking advantage of its high efficiency and parallelism. However, the mechanism of parallelism error reduced by the DSL process was rarely investigated. Furthermore, the relationship between parallelism and flatness was not clearly illustrated. To explain why the parallelism of workpieces becomes convergent by the DSL, a theoretical model has been developed in this paper by calculating the parallelism evolution with the consideration of various contact situations between workpieces and lapping plates for the first time. Moreover, five workpieces, including a slanted and four parallel ones, are applied to develop the parallelism evolution guaranteeing the model close to the actual process, and the mechanism of the parallelism error reduced by the DSL process is elucidated. The calculation result revealed that the parallelism was improved from 100.0 µm to 25.6 µm according to the proposed model. The experimental results showed that the parallelism error reduced from 108.6 µm to 28.2 µm, which was consistent with the calculation results.

Funder

National Natural Science Foundation of China

Science Fund for Creative Research Groups

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Three-dimensional characterization of abrasive chips using micro-computed tomography;The International Journal of Advanced Manufacturing Technology;2024-06-22

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