Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals

Author:

Lambert M. A.1,Fletcher L. S.2

Affiliation:

1. Department of Mechanical Engineering, San Diego State University, San Diego, CA 92182-1323

2. Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123

Abstract

Thermal contact conductance is an important consideration in such applications as nuclear reactor cooling, electronics packaging, spacecraft thermal control, and gas turbine and internal combustion engine cooling. In many instances, the highest possible thermal contact conductance is desired. For this reason, soft, high conductivity, metallic coatings are sometimes applied to contacting surfaces (often metallic) to increase thermal contact conductance. O’Callaghan et al. (1981) as well as Antonetti and Yovanovich (1985, 1988) developed theoretical models for thermal contact conductance of metallic coated metals, both of which have proven accurate for flat, rough surfaces. However, these theories often substantially overpredict the conductance of non-flat, rough, metallic coated metals. In the present investigation, a semi-empirical model for flat and non-flat, rough, uncoated metals, previously developed by Lambert and Fletcher (1996), is employed in predicting the conductance of flat and non-flat, rough, metallic coated metals. The models of Antonetti and Yovanovich (1985, 1988) and Lambert and Fletcher (1996) are compared to experimental data from a number of investigations in the literature. This entailed analyzing the results for a number of metallic coating/substrate combinations on surfaces with widely varying flatness and roughness. Both models agree well with experimental results for flat, rough, metallic coated metals. However, the semi-empirical model by Lambert and Fletcher (1996) is more conservative than the theoretical model by Antonetti and Yovanovich (1985, 1988) when compared to the majority of experimental results for non-flat, rough, metallic coated metals.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Preparation and Properties of Thermal Interface Materials;Thermal Management Materials for Electronic Packaging;2023-12-15

2. Thermal conductivity analysis of porous NiAl materials manufactured by spark plasma sintering: Experimental studies and modelling;International Journal of Heat and Mass Transfer;2022-09

3. Effect of interface morphology on thermal contact resistance in thermal management of electronic devices;International Journal of Modern Physics B;2022-05-07

4. Numerical study on thermal contact resistance of 8-harness satin woven pierced composite;International Journal of Thermal Sciences;2021-01

5. Research Progress of Thermal Contact Resistance;Journal of Low Temperature Physics;2020-07-18

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3