Thermomechanical Analytical 3D Thermal/Stress Estimation Sidewall Grinding Model

Author:

Li Ya Yun1,Kim Jongwon1,Sun Yunquan1,Yang Yanhua1

Affiliation:

1. Precision Manufacturing Center, The University of Connecticut, Storrs, CT 06269-5119

Abstract

A general three-dimensional thermal/stress grinding model, based on thermal and elastic/plastic classical analytical solutions, has been developed in this paper. The thermal model can predict the temperature distribution of surface and cylindrical external/internal creep-feed or conventional grinding for vertical or inclined sidewall surface grinding. This paper deals with a grinding burn problem that is widespread in the aerospace and automotive industries. The thermal model is compared with sidewall surface grinding experiments. The comparison of the temperature distribution results is expected. The general stress model has been developed, which combines both spherical and cylindrical coordinates. In addition, the 3D thermal/stress model is compared with four cases of external cylindrical grinding experiments. The residual stresses agree reasonably.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference26 articles.

1. Carslaw, H. S., and Jaeger, J. C, 1959, Conduction of Heat in Solids, Oxford at Clarendon Press.

2. Chiu, N., 1993, “Computer Simulation for Form Grinding Process,” Ph.D. Dissertation, University of Massachusetts at Amherst.

3. Chiu, N., and Malkin, S., 1994, “Computer Simulation for Creep-Feed Form Grinding,” Trans. of the North American Manufacturing Research Institution of ASME, 1994, pp. 119–126.

4. Eshelby J. D. , 1957, “The Determination of the Elastic Field of an Ellipsoidal Inclusion, and Related Problems,” Proceedings of the Royal Society, London, Vol. A241, pp. 376–396.

5. Guo, C, 1993, “Investigation of Fluid Flow and Heat Transfer in Grinding,” Ph.D. Dissertation, University of Massachusetts at Amherst.

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