An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Author:

Du Yong1,Zhao Jie-Hua1,Ho Paul1

Affiliation:

1. Laboratory for Interconnect and Packaging, The University of Texas at Austin, PRC/MER, Mail Code R8650, Austin, TX 78712-1100

Abstract

An optical method was developed to measure the two-dimensional (2D) surface curvatures of electronic packages by employing four laser beams. Each laser beam measures the slopes of the surface at the incident point along two perpendicular directions. By combining four pairs of slopes, the 2D surface curvatures of the package can be calculated. The surface warpage of an underfilled flip-chip package during thermal cycling was measured by this method and the result was verified by finite element analysis (FEA). Both experimental and FEA results show that the surface warpage is almost a linear function of temperature between 25°C and 150°C for the measured package.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Chua, Teo Yong, et al., 1995, “BGA Package Analysis using FEA,” SEMICON/West.

2. Kuan, Lee Choon, and Cheng, Yan Ji, 1998, “Warpage in Plastic IC Packages,” 48th ECTC.

3. Miyake, Kiyoshi, and Saitou, Kiyoshi, 1997, “Analysis of Warpage of Surface Mount Devices,” JSME The 10th Computer Mechanics Conf.

4. Finot, M., Blech, I. A., Suresh, S., and Fujimoto, H., 1997 “Large Deformation and Geometric Instability of Substrate with Thin-film Deposits,” J. Appl. Phys., 81, pp. 3457–3464.

5. Timoshenko, S., 1940, Theory of Plates and Shells, Chapter II, McGraw-Hill, New York and London.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3