Preferential Orientation of Silicon Blocks During Fluidic Self-Assembly of Microelectronics

Author:

Brasoava Adriana1,Danescu Radu2,Srinivasan Visvanathan1,Wells David1

Affiliation:

1. North Dakota State University

2. GE Power Systems

Abstract

Fluidic Self-Assembly (FSA) is a newly developed, high productivity method to assemble millimeter and submillimeter size silicon electronic components (blocks) into circuit boards. Large numbers of thin, truncated pyramid shaped components are released in water and move gravitationally down inclined substrates to fall into indentations (receptors) of complementary shape. To increase the rate of receptor filling and improve the process efficiency, the probability of proper alignment between blocks and receptors must be maximized. The present paper reports an experimental study aimed at determining the preferential orientation of the blocks in a practical FSA process. Blocks ranging in size from 1050 to 3050 microns were tested for: (i) in-plane orientation angle during their motion, and (ii) right-side-up (RSU) versus up-side-down (USD) landing upon dispensing. Results indicate that blocks exhibit a high degree of in-plane angular self-orientation, which depends on the block aspect ratio. Spatial orientation of blocks at the release point is a decisive factor on their correct (RSU) landing on the substrate. Based on this observation, an original dispensing strategy was developed that increased the RSU fraction to values typically over 90%.

Publisher

ASMEDC

Reference9 articles.

1. Cohn, M.B., Bohringer, K. F., Noworlski, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., and Howe, R. T., 1998, “Microassembly Technologies for MEMS,” Proc. SPIE Micromachining and Microfabrication. Santa Clara, CA. pp. 216–230.

2. Singh A. , HorsleyD. A., CohnM. B., PisanoA. P., and HoweR. T., 1999, “Batch Transfer of Microstructures Using Flip-Chip Solder Bonding,” IEEE J. of Electromechanical Systems, Vol. 8(1), pp. 27–33.

3. Whitesides G. M. , and GrzybowskiB., March 29 2002, “Self-Assembly at All Scales,” Science, Vol. 295(5564), pp. 24182418.

4. O’Riordan A. , RedmondG., DeanT., and PezM., 2003, “Field-Configured Self-Assembly: Manufacturing at the Mesoscale” Material Science and Engineering, vol. C23, pp. 3–6.

5. Hosokawa K. , ShimoyamaI., and MiuraH., 1996, “Two-Dimensional Micro Self Assembly Using the Surface Tension of Water,” Sens. Actuators, Vol. A57, pp. 117–125.

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Micro-Embossing of Polymeric Substrates for Fluidic Self-Assembly;Microelectromechanical Systems;2006-01-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3