Affiliation:
1. University of Michigan
Abstract
Abrasion plays an important role in the manufacture and use of certain microstructures. In this paper, we explore the nano-scale abrasion characteristics of Al, Si, Pyrex™ glass, and glass-mica ceramic (Macor™), using a commercial scribing tool adapted to provide controlled velocity and force, and accurate positioning for abrasion utilizing two abrasion heads: a diamond facet edge and a custom alumina-grit head. While Al is easily abraded, it tends to create build-up of material along the edges. Silicon provides triangular clean groves with minimum widths ≈ 460 nm. Macor provides scalloped grooves that show some chipping and have minimum widths of ≈ 320 nm. Glass provides clean, rounded grooves, with minimum widths of ≈ 200 nm. This paper also describes how controlled abrasion can be exploited for the non-lithographic fabrication of nanochannels which are of interest in several fluidic devices.
Reference15 articles.
1. Sun
W.
, PeiZ. J., FisherG. R., 2004, “Fine grinding of silicon wafers: a mathematical model for the wafer shape,” International Journal of Machine Tools & Manufacture, 44, pp. 707–716
2. Pei
Z. J.
, StrasbaughA., 2002, “Fine grinding of silicon wafers: designed experiments,” International Journal of Machine Tools & Manufacture, 42, pp. 395–404.
3. Zhao
Y.
, ChangL., 2002, “A micro-contact and wear model for chemical-mechanical polishing of silicon wafers,” Wear, 252, pp. 220–226.
4. Miller
S. L.
, RodgersM. S., La VigneG., SniegowskiJ. J., ClewsP., TannerD. M., PetersonK. A., 1999, “Failure modes in surface micromachined microelectromechanical actuation systems,” Microelectronics Reliability, 39, 1229–1237.
5. Chu, L.L., Nelson, D., Oliver, A.D., Gianchandani, Y.B., 2003, “Performance enhancement of polysilicon electrothermal microactuators by localized self-annealing,” IEEE MEMS, pp. 68–71.