Residual Stress Variation in Polysilicon Thin Films

Abstract

This paper compares the use of four mechanical methods for characterization of residual stress variation in low pressure chemical vapor deposited (LPCVD) polysilicon thin films deposited, doped, and annealed under different conditions. Stress was determined using buckling structures, vibrating microstructures, static rotating structures and the wafer curvature method. After deposition of 1.0 μm of polysilicon at 625°C and 588°C the stress in the wafers is 230 MPa compressive (stdev = 1.2 MPa) and 340 MPa compressive (stdev = 10.4 MPa), respectively. Deposition of 0.6 μm at 580°C results in a tensile stress of 66 MPa (stdev= 52 MPa). Following doping, all stresses are compressive. Boron doping of the 625°C and 588°C deposited films produces a compressive stress of 149 MPa (stdev= 28.6 MPa) and 100 MPa (stdev= 29.5 MPa). Phosphorous doping of the 588°C and 580°C deposited films produces a compressive stress of 54 MPa (stdev = 0.3 MPa) and 80 MPa (stdev= 5.3 MPa), respectively. Annealing through rapid thermal processing (RTP) at temperatures of 1000°C – 1100°C reduced the stresses by 20-50 MPa, but the stresses remained compressive. These values are measured using the wafer curvature method. Values obtained from the other microstructure methods agree with stresses determined by wafer curvature with the exception of the rotating structures which showed 20% lower stress readings.