Boiling Performance of Flourinert PF 5060 on Confined and Unconfined Wire Meshes Soldered to the Substrate

Abstract

The boiling performance of the dielectric fluorocarbon liquid PF 5060 was measured on submerged 0.9 cm square tin-plated copper and bronze wire meshes soldered to a copper block. Three mesh sizes were tested: 8 wires/cm (20 wires/inch) with 406 micron diameter, 20 wires/cm (50 wires/inch) with 229 micron diameter, and 59 wires/cm (150 × 150 wires/inch) with 66 micron diameter. The curves were measured with top of the mesh open in a pool boiling arrangement and with the mesh covered with a plate so that bubbles must exit sideways.