Affiliation:
1. State University of New York at Binghamton
Abstract
The purpose of this paper is to investigate the indium joint strength with known indium oxide thickness. The indium joint strength was assessed by measuring the maximum load of indium solder with the comparison of the wetting angle. The oxide thickness was already grown in different ambient conditions, and provided for the joint strength measurement. The indium joint strength with different oxide thicknesses was tested at a fixed strain rate by tensile loading. This investigation will be very useful to characterize the indium solderability in different environment in terms of the quantitative joint strength.
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