Continuum Damage Mechanics Modeling of High-Temperature Flaw Propagation: Application to Creep Crack Growth in 316H Standardized Specimens and Nuclear Reactor Components

Author:

Recuero Antonio M.1,Petkov Markian2,Spencer Benjamin W.1ORCID,Juan Pierre-Alexandre2

Affiliation:

1. Idaho National Laboratory , P.O. Box 1625, Idaho Falls, ID 83415-3840

2. Kairos Power LLC , 707 West Tower Avenue Suite A, Alameda, CA 94501

Abstract

Abstract Predicting creep crack growth (CCG) of flaws found during operation in high-temperature alloy components is essential for assessing the remaining lifetime of those components. While defect assessment procedures are available for this purpose in design codes, these are limited in their range of applicability. This study assesses the application of a local damage-based finite element methodology as a more general technique for the prediction of CCG at high temperatures on a variety of structural configurations. Numerical results for stainless steel 316H, which are validated against experimental data, show the promise of this approach. This integration of continuum damage mechanics (CDM) based methodologies, together with adequate inelastic models; into assessment procedures can therefore inform the characterization of CCG under complex operating conditions while avoiding excessive conservatism. This article shows that such modeling frameworks can be calibrated to experimental data and used to demonstrate that the degree of triaxiality ahead of a growing creep crack affects its rate of growth. The framework is also successfully employed in characterizing CCG in realistic reactor pressure vessel geometry under an arbitrary loading condition. These results are particularly relevant to the nuclear power industry for defect assessment and inspections as part of codified practices of structural components with flaws in high-temperature reactors.

Funder

U.S. Department of Energy

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Safety, Risk, Reliability and Quality

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