Microstructure and Mechanical Properties of Sputter-Deposited Ti-Ni Alloy Thin Films
Author:
Affiliation:
1. National Research Institute for Metals, Tsukuba, Ibaraki 305-0047, Japan
2. Institute of Materials Science, University of Tsukuba, Tsukuba, Ibaraki 305-8573, Japan
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/materialstechnology/article-pdf/121/1/2/5879854/2_1.pdf
Reference30 articles.
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2. Chang L. , SimpsonC. Hu, GrummonD. S., PrattW., and LoloeeR., 1990, “Structure and Phase Transformations in Thermoelastic Ni(1-x)TiCu(x) Thin Films Prepared by D.C. Magnetron Sputtering,” Mat. Res. Soc. Symp. Proc., Vol. 187, p. 137137.
3. Chang L. , and GrummonD. S., “Structure Evolution in Sputtered Thin Films of Tix (Ni, Cu)1-x I: Diffusive Transformations,” Phil. Mag. A, Vol. 76, p. 163163.
4. Gyobu A. , KawamuraY., HorikawaH., and SaburiT., 1996, “Martensitic Transformations in Sputter-Deposited Shape Memory Ti-Ni Films,” Mater. Trans. JIM, Vol. 37, p. 697697.
5. Hashinaga T. , MiyazakiS., UekiT., and HorikawaH., 1995, “Transformation and Deformation Behavior in Sputter-Deposited Ti-Ni-Cu Thin Films,” J. Physique IV, Vol. 5, p. 8–689.
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