Quantitative Characterization of a Flip-Chip Solder Joint-Reference-Cited by-同舟云学术

Quantitative Characterization of a Flip-Chip Solder Joint

Published:1995-06-01 Issue:2 Volume:62 Page:390-397
ISSN:0021-8936
Container-title:Journal of Applied Mechanics
language:en
Short-container-title:

Author:

Patra S. K.¹,Sritharan S. S.²,Lee Y. C.¹

Affiliation:

1. Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309

2. Department of Mathematics, University of California, Los Angeles, CA 90024-1555

Abstract

Based on an energy minimization principle, a mathematical/numerical model has been developed to study the impact of design and process variations associated with flip-chip solder joint on its ability to align in lateral and axial direction. The minimum-energy shape needed for joint evaluation is computed by a novel numerical method based on motion by mean curvature. The analysis shows that (1) the magnitude of the reaction force in lateral and axial direction reduces with increase in solder volume, (2) the normal reaction is an order of magnitude higher compared to the lateral reaction (restoring force) thus making the joint more susceptible to lateral misalignment compared to the axial misalignment, and (3) the axial misalignment is primarily dictated by the accuracy of the solder deposition height.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

Link

http://asmedigitalcollection.asme.org/appliedmechanics/article-pdf/62/2/390/5463875/390_1.pdf

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