Unified Criterion for Brittle–Ductile Transition in Mechanical Microcutting of Brittle Materials
Author:
Affiliation:
1. School of Mechanical Engineering, Shandong University of Technology, Zibo 255049, China
2. Department of Mechanical Engineering, The University of Alabama, Tuscaloosa, AL 35487 e-mail:
Abstract
Publisher
ASME International
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering
Link
http://asmedigitalcollection.asme.org/manufacturingscience/article-pdf/doi/10.1115/1.4027996/6264029/manu_136_05_051013.pdf
Reference24 articles.
1. Micro-End-Milling of Single-Crystal Silicon;Int. J. Mach. Tools Manuf.,2007
2. Cutting Process in Glass Peripheral Milling;J. Mater. Process. Technol.,2013
3. A Study on the Effect of Tool Cutting Edge Radius on Ductile Cutting of Silicon Wafers;Int. J. Adv. Manuf. Technol.,2007
4. An Experimental Study on Microcutting of Silicon Using a Micromilling Machine;Int. J. Adv. Manuf. Technol.,2008
5. Ductile Behavior in Single-Point Diamond-Turning of Single-Crystal Silicon;J. Mater. Process. Technol.,2002
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