Fundamental Performance Limits of Heatsinks

Author:

Copeland David Watabe1

Affiliation:

1. Fujitsu Laboratories of America, San Jose, CA 95134-1402

Abstract

Dedicated fan-duct-heatsink combinations have become a standard means of cooling computer processors. Most previous studies have considered optimization of fin geometry (pitch and thickness) with overall heatsink dimensions (width, height, length) fixed. The present study considers size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power, and fixed thermal conductance. First, an ideal heatsink with infinite fin thermal conductivity is considered, providing simple power-law prediction of performance. Next, fins of finite thermal conductivity and thickness, as well as effects of developing flow are included in the analysis, permitting prediction and minimization of weight. Models of both levels of complexity can be used, previous to more detailed numerical and/or experimental studies, to design optimized heatsinks.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Knight, R. W., Goodling, J. S., and Hall, D. J., 1991, “Optimum Design of Forced Convection Heat Sinks—Analytical,” ASME J. Electronic Packag., 113(3), pp. 313–321.

2. Azar, K., McLeod, R. S., and Caron, R. E., 1992, “Narrow Channel Heat Sink for Cooling of High Powered Electronic Components,” Proc Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 12–19.

3. Lee, S. , 1995, “Optimum Design and Selection of Heat Sinks,” IEEE Trans., Components, Packaging and Manufacturing Technology—Part A, 18, No. 4, pp. 812–817.

4. Biber, C. R., and Fijol, S., 1999, Fan—plus—Heatsink “Optimization”—Mechanical and Thermal Design with Reality, Proc Int Systems Packaging Symposium, pp. 12–19.

5. Teertstra, P., Yovanovich, M. M., Culham, J. R., and Lemczyk, T., 1999, “Analytical Forced Convection Modeling of Plate Fin Heat Sinks,” Proc., Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 34–41.

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