Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers
Author:
Affiliation:
1. Department of Physics and Engineering Physics, University of Colorado at Boulder, Boulder, CO 80309
2. Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309
Abstract
Funder
University of Colorado Boulder
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4042255/6394340/ep_141_01_011005.pdf
Reference32 articles.
1. Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions;IEEE Trans. Compon., Packag., Manuf. Technol.,2017
2. Hell, P. M., Varga, P. J., and Illési, Z., 2018, “Mobile Phones Thermo-Ergonomic Analysis,” IEEE 16th International Symposium on Intelligent Systems and Informatics (SISY), Subotica, Serbia, Sept. 13–15, pp. 249–254.10.1109/SISY.2018.8524654
3. How Much of Wireless Rates Can Smartphones Support in 5G Networks?,2018
4. Two-Phase Thermal Ground Planes: Technology Development and Parametric Results;ASME J. Electron. Packag.,2015
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview;Renewable and Sustainable Energy Reviews;2022-12
2. Experimental investigation on the thermal characteristics of ultrathin vapour chamber with in-plane bending;Applied Thermal Engineering;2022-11
3. Squid‐like soft heat pipe for multiple heat transport;Droplet;2022-10
4. Numerical study of single-loop pulsating heat pipe with porous wicking layer;International Journal of Thermal Sciences;2022-09
5. A non-contact thermal testing system for ultra-thin vapor chamber;Review of Scientific Instruments;2021-12-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3