Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate

Author:

Kraus Allan D.1

Affiliation:

1. Professor Emeritus University of Akron

Abstract

The forced cooled electronic chassis is revisited and, because of recent developments, changes which amend the design procedure are proposed. These considerations involve the thickness of the cover and splitter plates dictated by the Murray–Gardner assumptions, the impact of the so-called heat flow choke, and the development of a new concept involving the equivalent height of a fin. The current literature is reviewed and summarized, so that the new concept proposed here can be clearly apparent.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. “Design and Performance of Air-Cooled Chassis for Electronic Equipment,”;Mark;IEEE Trans. Compon. Parts

2. “Efficiency of the Cold Plate Heat Exchanger,”;Kraus

3. “Optimization of the Cold Plate Heat Exchanger,”;Kraus

4. Smith, R. K. , 1960, private communication.

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