Affiliation:
1. Imec, Leuven, Belgium
2. Interflux Electronics, Ghent, Belgium
Abstract
Abstract
SnBi based solder alloys become an interesting alternative for standard SnAgCu as they can be used to solder components at much lower temperature. The typically 50°C lower solder reflow temperature is less damaging for PCB and components, and also prevents hot tear and head-in-pillow failures for large fine pitch BGA components. A reasonable concern for these low-melting temperature solders is the thermal cycling reliability performance, in particular for harsh conditions such as automotive products. In this work, thermal cycling testing and failure analysis have been performed on 9 × 9 mm size QFN components and large chip components (2010 and 2512) which are typically sensitive to thermal fatigue. The results are benchmarked to standard SAC alloy. Also the process advantages from the low temperature solder alloys are depicted in this paper. Finally, the effect of Pb contamination on this SnBi based solder is investigated.
Publisher
American Society of Mechanical Engineers
Cited by
3 articles.
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1. Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. A Review of Low-Temperature Solders in Microelectronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04
3. Low Temperature Formation of SAC-SnBi BGA Interconnections using Solid Liquid Inter-Diffusion (SLID);2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05