An Analysis of Heat Transfer in Josephson Junction Devices

Author:

Lavine A. S.1,Bai C.1

Affiliation:

1. University of California, Los Angeles, Los Angeles, CA 90024-1597

Abstract

Josephson junctions are electronic devices made from superconducting materials that cycle between resistive and nonresistive states. Heat generated in the resistive state causes a temperature rise, which may adversely affect electrical behavior, by reducing the critical Josephson current. In this work, temperature distributions and resulting reductions in critical current are calculated for Josephson junctions made from low and high-temperature superconductors. It is found that an unacceptable reduction in critical current may occur for junctions made from high-temperature materials. This problem can almost certainly be overcome, but perhaps at the expense of one advantage of Josephson junctions, namely compactness.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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1. Thermal Modeling of Rapid Single Flux Quantum Circuit Structures;IEEE Transactions on Electron Devices;2022-05

2. Future heat transfer concerns in Josephson junction computers;IEEE Transactions on Components and Packaging Technologies;1999

3. Spray cooling of power electronics at cryogenic temperatures;Journal of Thermophysics and Heat Transfer;1995-01

4. Spray cooling of power electronics at cryogenic temperatures;32nd Aerospace Sciences Meeting and Exhibit;1994-01-10

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