Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board-Reference-Cited by-同舟云学术

Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board

Published:2004-03-01 Issue:1 Volume:126 Page:14-21
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Weinstein Randy D.¹,Fleischer Amy S.²,Krug Kimberly A.¹

Affiliation:

1. Department of Chemical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085

2. Department of Mechanical Engineering, Center for Advanced Communications, Villanova University, Villanova, PA 19085

Abstract

Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures (60°C and 100°C above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect of heat source location on maximum power dissipation is presented for both horizontal and vertical orientations. Heat losses due to radiation, natural convection and board conduction are quantified. As long as the heat sources are more than 2 cm apart, they do not influence each other on the FR4 board. Vertical orientation increases the power dissipation in the components by up to 30% for the FR4 board and 15% for the copper clad board. Two ounces of copper cladding increases the overall power dissipation by 150–190%.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/126/1/14/5558817/14_1.pdf

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