Axisymmetric Peeling of Thin Elastic Films: A Perturbation Solution

Author:

Chen Erteng1,Dai Zhaohe1

Affiliation:

1. College of Engineering, Peking University Department of Mechanics and Engineering Science, State Key Laboratory for Turbulence and Complex Systems, , Beijing 100871 , China

Abstract

Abstract We study the mechanical behavior of a thin elastic film that is affixed to a rigid substrate and subjected to a transverse force using a shaft with a finite radius. This scenario, also referred to as axisymmetric peeling, is encountered frequently in conventional blister tests as well as in our daily lives when removing an adhesive film from a substrate. Our primary objective is to gain a quantitative understanding of how the shaft’s radius influences the relationships between force and displacement, as well as between force and delamination areas. These relationships can serve as a dependable method to determine both the film’s elastic modulus and the adhesion strength between the film and its substrate. In this work, we provide a simple perturbation solution to this geometrically nonlinear problem while avoiding any use of ad hoc assumptions that were previously required. As a result, our results are in excellent agreement with numerical simulations and offer improved accuracy compared to analytical solutions available in the literature.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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