Analytical Studies on Mode III Fracture in Flexoelectric Solids

Author:

Tian Xinpeng12,Xu Mengkang3,Zhou Haiyang12,Deng Qian12,Li Qun3,Sladek Jan4,Sladek Vladimir4

Affiliation:

1. Department of Engineering Mechanics, School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan 430074, China;

2. Hubei Key Laboratory of Engineering Structural Analysis and Safety Assessment, Luoyu Road 1037, Wuhan 430074, China

3. State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace Engineering, Xi’an Jiaotong University, Xi’an 710049, China

4. Department of Mechanics, Slovak Academy of Sciences, Bratislava 984503, Slovak

Abstract

Abstract Due to the stress concentration near crack tips, strong flexoelectric effect would be observed there, which might lead to new applications of flexoelectricity in material science and devices. However, different from the flexoelectric effect in cantilever beams or truncated pyramids, at the crack tip, multiple components of strain gradients with nonuniform distribution contribute to the flexoelectric effect, which makes the problem extremely complex. In this paper, with the consideration of both direct and converse flexoelectricity, the electromechanical coupling effect around the tip of a Mode III crack is studied analytically. Based on the Williams’ expansion method, the displacement field, polarization field, strain gradient field along with the actual physical stresses field are solved. A path-independent J-integral for Mode III cracks in flexoelectric solids is presented. Our results indicate that the existence of flexoelectricity leads to a decrease of both the J-integral and the out-of-plane displacement in Mode III cracks, which means that the flexoelectric effect around the tip of Mode III cracks enhances the local strength of materials.

Funder

National Natural Science Foundation of China

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

Reference43 articles.

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