Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

Abstract

A study is reported of heat transfer and air flow in an electronic module consisting of an array of narrowly spaced vertical circuit boards with highly-protruding components contained in a naturally vented chassis. A two-dimensional simulation model is developed that accounts for heat transfer by conduction, convection, and radiation, and sensitivity studies are performed. Experiments are conducted using a specially constructed test module. Comparisons with the experiments reveal the need to calibrate the model by selecting an effective component height that represents the drag properties of the actual three-dimensional component geometry. The need to account in the model for heat losses in the depth direction is also discussed. The importance of accurate thermophysical properties and of multi-dimensional radiation is shown. Good agreement with measured velocities and local board temperatures is obtained over a wide range of power levels, and it is concluded that the calibrated model is capable of representing the thermal behavior of the present module.