The Interface Behavior of Multiple Piezoelectric Films Attaching to a Finite-Thickness Gradient Substrate

Author:

Chen Peijian1,Chen Shaohua2,Liu Hao3,Peng Juan4,Gao Feng1

Affiliation:

1. State Key Laboratory for Geomechanics and Deep Underground Engineering; School of Mechanics and Civil Engineering, China University of Mining and Technology, Xuzhou, Jiangsu 221116, China

2. Institute of Advanced Structure Technology; Beijing Key Laboratory of Lightweight Multi-Functional Composite Materials and Structures, Beijing Institute of Technology, Beijing 100081, China

3. School of Mechanical and Electrical Engineering, China University of Mining and Technology, Xuzhou, Jiangsu 221116, China

4. School of Physics, China University of Mining and Technology, Xuzhou, Jiangsu 221116, China

Abstract

Abstract The interface behavior of multiple piezoelectric films attaching to a gradient substrate under the action of electromechanical coupling is studied. The effect of neighboring films on the interface response is mainly concerned, including the interface stress, the stress intensity factors near both ends of piezoelectric films and the normal stress of films. In order to solve such a boundary value problem, Fourier transformation is used to achieve governing integro-differential equations, which could further demonstrate the interface behavior. The results show that, in comparison with the single-film model, both the interface stress and the normal stress of films are significantly affected by adjacent piezoelectric films. When the equivalent stiffness of the substrate or the distance between neighboring piezoelectric films becomes larger, the interaction between adjacent piezoelectric films gradually weakens. In addition, both shorter piezoelectric films and softer or thicker intermediate adhesive layers are beneficial to the interface property. The results should be helpful for the accurate measurement of surface sensors and the arrangement of multipoint health detection of gradient structures.

Funder

NSFC

Fundamental Research Funds for the Central Universities

Priority Academic Program Development of Jiangsu Higher Education Institutions

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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